AR32-HZW/T-R
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BRVN:BRVN-AR32-HZW/T-R
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MPN:AR32-HZW/T-R
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MFR:
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Description:CONN IC DIP SOCKET 32POS TIN
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: CONN IC DIP SOCKET 32POS TIN
- Manufacturer: ASSMANN WSW Componets
- Length: 0 mm
- Series: -
- Product Status: Obsolete
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Operating Temperature: -40°C ~ 105°C
- Housing Material: Thermoplastic, Polyester, Glass Filled
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
