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HSS21-B20-P53

BRVN:

BRVN-HSS21-B20-P53
MPN:

HSS21-B20-P53
MFR:

CUI Devices
Description:

HEAT SINK, STAMPING, TO-218/TO-2

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

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Description: HEAT SINK, STAMPING, TO-218/TO-2

Manufacturer: CUI Devices
Length: 0 mm
Series: HSS
Product Status: Active
Type: Board Level
Material: Aluminum Alloy
Shape: Rectangular, Fins
Package Cooled: TO-218, TO-220
Attachment Method: PC Pin
Width: 0.961" (24.40mm)
Diameter: -
Fin Height: 0.500" (12.70mm)
Power Dissipation Temperature Rise: 3.58W @ 75°C
Thermal Resistance Forced Air Flow: 10.10°C/W @ 200 LFM
Thermal Resistance Natural: 20.93°C/W
Material Finish: Black Anodized

Datasheet: BRVN-HSS21-B20-P53