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HSS01-B20-CP

  • BRVN:
    BRVN-HSS01-B20-CP
  • MPN:
    HSS01-B20-CP
  • MFR:
  • Description:
    HEAT SINK, STAMPING, TO-220, 49.
Datasheet

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  • Description: HEAT SINK, STAMPING, TO-220, 49.
  • Manufacturer: CUI Devices
  • Length: 0 mm
  • Series: HSS
  • Product Status: Active
  • Type: Board Level, Vertical
  • Material: Aluminum Alloy
  • Shape: Rectangular
  • Package Cooled: TO-220
  • Attachment Method: Bolt On and PC Pin
  • Width: 1.900" (48.26mm)
  • Diameter: -
  • Fin Height: 0.950" (24.13mm)
  • Power Dissipation Temperature Rise: 9.9W @ 75°C
  • Thermal Resistance Forced Air Flow: 3.70°C/W @ 200 LFM
  • Thermal Resistance Natural: 7.59°C/W
  • Material Finish: Black Anodized