HSB28-606022
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BRVN:BRVN-HSB28-606022
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MPN:HSB28-606022
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MFR:
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Description:HEAT SINK, BGA, 60 X 60 X 22 MM,
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: HEAT SINK, BGA, 60 X 60 X 22 MM,
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSB
- Product Status: Active
- Type: -
- Material: -
- Shape: -
- Package Cooled: -
- Attachment Method: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation Temperature Rise: -
- Thermal Resistance Forced Air Flow: -
- Thermal Resistance Natural: -
- Material Finish: -
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- Datasheet: BRVN-HSB28-606022
