HSB23-232325
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BRVN:BRVN-HSB23-232325
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MPN:HSB23-232325
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MFR:
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Description:HEAT SINK, BGA, 23 X 23 X 25 MM
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: HEAT SINK, BGA, 23 X 23 X 25 MM
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSB
- Product Status: Active
- Type: Top Mount
- Material: Aluminum Alloy
- Shape: Square, Pin Fins
- Package Cooled: BGA
- Attachment Method: Adhesive
- Width: 0.906" (23.00mm)
- Diameter: -
- Fin Height: 0.984" (25.00mm)
- Power Dissipation Temperature Rise: 6.13W @ 75°C
- Thermal Resistance Forced Air Flow: 3.80°C/W @ 200 LFM
- Thermal Resistance Natural: 12.23°C/W
- Material Finish: Black Anodized
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- Datasheet: BRVN-HSB23-232325
