HSB20-353525
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BRVN:BRVN-HSB20-353525
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MPN:HSB20-353525
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MFR:
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Description:HEAT SINK, BGA, 35 X 35 X 25 MM
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
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- Description: HEAT SINK, BGA, 35 X 35 X 25 MM
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSB
- Product Status: Active
- Type: Top Mount
- Material: Aluminum Alloy
- Shape: Square, Pin Fins
- Package Cooled: BGA
- Attachment Method: Adhesive
- Width: 1.378" (35.00mm)
- Diameter: -
- Fin Height: 0.984" (25.00mm)
- Power Dissipation Temperature Rise: 11.3W @ 75°C
- Thermal Resistance Forced Air Flow: 2.70°C/W @ 200 LFM
- Thermal Resistance Natural: 6.65°C/W
- Material Finish: Black Anodized
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- Datasheet: BRVN-HSB20-353525
