HSB19-272718
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BRVN:BRVN-HSB19-272718
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MPN:HSB19-272718
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MFR:
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Description:HEAT SINK, BGA, 27 X 27 X 18 MM
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
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- Description: HEAT SINK, BGA, 27 X 27 X 18 MM
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSB
- Product Status: Active
- Type: Top Mount
- Material: Aluminum Alloy
- Shape: Square, Pin Fins
- Package Cooled: BGA
- Attachment Method: Adhesive
- Width: 1.063" (27.00mm)
- Diameter: -
- Fin Height: 0.709" (18.00mm)
- Power Dissipation Temperature Rise: 6.8W @ 75°C
- Thermal Resistance Forced Air Flow: 4.50°C/W @ 200 LFM
- Thermal Resistance Natural: 11.11°C/W
- Material Finish: Black Anodized
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- Datasheet: BRVN-HSB19-272718
