HSB01-080808
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BRVN:BRVN-HSB01-080808
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MPN:HSB01-080808
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MFR:
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Description:HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
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- Description: HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSB
- Product Status: Active
- Type: Top Mount
- Material: Aluminum Alloy
- Shape: Square, Pin Fins
- Package Cooled: BGA
- Attachment Method: Adhesive
- Width: 0.335" (8.50mm)
- Diameter: -
- Fin Height: 0.315" (8.00mm)
- Power Dissipation Temperature Rise: 1.9W @ 75°C
- Thermal Resistance Forced Air Flow: 16.00°C/W @ 200 LFM
- Thermal Resistance Natural: 39.10°C/W
- Material Finish: Black Anodized
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- Datasheet: BRVN-HSB01-080808
