A 22-LC-T2
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BRVN:BRVN-A 22-LC-T2
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MPN:A 22-LC-T2
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MFR:
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Description:CONN IC DIP SOCKET 22POS TIN
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: CONN IC DIP SOCKET 22POS TIN
- Manufacturer: ASSMANN WSW Componets
- Length: 0 mm
- Series: -
- Product Status: Active
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Operating Temperature: -55°C ~ 85°C
- Housing Material: Polybutylene Terephthalate (PBT)
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Number of Positions or Pins (Grid): 22 (2 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 60.0µin (1.52µm)
- Contact Material - Mating: Phosphor Bronze
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 60.0µin (1.52µm)
- Contact Material - Post: Phosphor Bronze
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- Datasheet: BRVN-A 22-LC-T2
